1. ball mill is a key equipment for further grinding after the primary crushing. the material evenly enters the first chamber of the grinder from the quill shaft in feeding device. the chamber is equipped with a ladder liner or ripple liner and steel balls in different specifications. centrifugal force caused by rotation of barrel brings the steel balls to a certain height and then falls down, which produces heavy impact and grinding effect on the material. materials after rough grinding in the first chamber shall enter into the second loaded with flat lining plate to go through further grinding, finally the ground materials are discharged by the discharging grate plate. ball mill is widely used in cement, silicate products, new building materials, wear-resistant materials, fertilizers, ferrous and non-ferrous metals, glass ceramics and other industries. according to the processing technology, it is divided into two grinding ways-the dry and the wet. besides,wet ball mill can be divided into tabular type and flowing type.tel:0086-371-5578880  email: ...
National University Science Park, West Third Ring Road, Zhengzhou, Henan, China National University Science Park, West Third Ring Road, Zhengzhou, Henan, China
Sncuinagsbbiznfealascd99.3±0.10.7±0.1< 0.01< 0.0001< 0.02< 0.01< 0.005< 0.02< 0.02< 0.03< 0.002the Sn99.3cu0.7 Lead Free Solder Bar Is Made Up Of 99.7% Tin And 0.7% Copper. It Is Desirable For Use In Common Metal Equipment, Copper Tubes, And Copper Plates. This Product Is A Conventional Type Of Environmentally-friendly Solder By Adoption Of Lead-free Soldering Technology.as A Typical Type Of High-temperature Lead Free Tin Bar, Our Sn99.3cu0.7 Lead Free Solder Has The Melting Point Of Approximately 227 Degrees Celsius. It Is Suitable For Both Wave Soldering And Dip Soldering Processes, Which Call For Environmental Protection. During The Soldering Process, This Product Features Nice Liquidity. It Can Substantially Reduce Various Technical Problems, Such As Bridging, Icicle, Solder Spatter, And More.featureseutectic Alloy.bridge-free And Icicle-free Soldering.smooth, Bright, Well-formed Fillets, Free Of Gross Micro-cracks, Irrespective Of The Cooling Rate.good Through-hole Penetration.good Topside Fillet Formation.dross Rate Equal Or Lower Than Tin-lead Solder.does Not Require A Nitrogen Atmosphere.does Not Erode Copper From Holes, Pads And Tracks.low Rate Of Copper Leaching Makes It Easy To Control The Copper Content Of The Solder Bath.lower Aggressiveness To Stainless Steel And Other Solder Pot Materials As Compared To Tin-silver-copper Alloys.thermal Fatigue Resistance And Creep Strength Better Than Tin-lead.slow, Even Growth Of The Intermetallic Layer At The Solder/substrate Interface.also Performs Well In Selective And Dip Soldering.applicationsdip Soldering Or Wave Soldering Of Electronic Components Such As Pcba, Thtsoldering Of Metals, Such As Copper Roofing Joineryassembly Of Stained Glass, Silver Jewelry Etcother Generally Tinning Purpose....
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